Enhanced etching characteristics of Si{100} in NaOH-based two-component solution

Abstract Silicon wet bulk micromachining is the most widely used technique for fabrication of diverse microstructures such as cantilevers, cavities, etc. in laboratory well industry micro-electromechanical system (MEMS) application. Although, increasing throughput remains inevitable, and can be done by etching rate. Furthermore, freestanding structure release time reduced improved undercutting rate at convex corners. In this work, we have investigated characteristics a non-conventional etchant form hydroxylamine (NH 2 OH) added sodium hydroxide (NaOH) solution. This research focused on Si{100} wafer orientation largely planer devices (e.g., complementary metal-oxide semiconductors) microelectromechanical systems inertial sensors). We performed systematic parametric analysis without with 12% NH OH 10 M NaOH etch rate, corners, etched surface morphology. 3D scanning laser microscope to measure average roughness ( R ), depth (d), length l ). Morphology examined using optical electron microscopes. The addition solution remarkably exhibited two-fold increment surface. significantly improves morphology Undercutting corners highly prudent quick from substrate. addition, studied effect age characteristics. Results presented article are large significance engineering applications both academic industrial laboratories.